Not having opened one up, I assumed, reasonably, that power FETs or similar would be bolted to heatsinks mounted to the case, in which case (no pun intended) cooling the case would be beneficial. Even if not mounted that way, cooling the case would still draw heat away from the unit by convection.
Looking at your picture it seems the chip is in fact using the case as a heatsink if that's heatsink compound on the case.
SMC warp ?? Never seen or heard of that ! Seen 'em explode, heat craze the pcb and make tracks & pads all but useless but never warp.
Do you have a solution to address what appears to be design deficiencies ?
Looking at your picture it seems the chip is in fact using the case as a heatsink if that's heatsink compound on the case.
SMC warp ?? Never seen or heard of that ! Seen 'em explode, heat craze the pcb and make tracks & pads all but useless but never warp.
Do you have a solution to address what appears to be design deficiencies ?